Thousands of continuing university and college students can now apply for Higher Education Loans Board (HELB) funding after the agency officially opened applications for subsequent loans for the 2026/2027 academic year.
In a notice issued on June 1, HELB announced that continuing students can submit their applications through the board’s USSD platform and urged eligible learners to apply within the stipulated period.
“The HELB Subsequent Loan Application for 2026/2027 is officially open from 1st June 2026,” the board announced.
HELB further directed students seeking continued financial support to submit their applications through *USSD code *642#.
The announcement provides relief to many students who depend on government loans to finance their studies amid rising education costs.
The latest communication, however, differs from an earlier statement made by HELB Chief Executive Officer Geoffrey Monari on May 28, when he indicated that the loan application portal for first-time applicants would be opened in the second week of July.
At the time, Monari explained that the board was waiting for several key processes involving other institutions to be completed before opening applications for new students.
“The HELB portal will be opened in the second week of July after a number of key procedures by the board and other related bodies have been aligned,” Monari said.
He noted that the board was awaiting completion of student placement by the Kenya Universities and Colleges Central Placement Service (KUCCPS) before opening the portal for first-time applicants.
“I want to assure all students, parents and stakeholders that they should be able to apply for their loans online when we open. We are just waiting for KUCCPS to complete their placement so that we can open, most probably by the second week of July,” he added.
Once applications for first-time students begin, applicants will be required to register through the HELB student portal and provide a range of personal and academic details.
Among the requirements will be KCPE and KCSE index numbers, a valid email address, telephone contact, passport-size photograph, national identification card, birth certificate for minors, parents’ identification details, guarantor information and copies of sponsorship letters where applicable.
The opening of the application window comes as the National Treasury has proposed a record allocation of KSh58 billion to student financing in the 2026/2027 financial year.
The proposed funding represents a significant increase from the KSh41 billion allocated previously and is expected to support implementation of the government’s Student-Centred Funding Model while easing financial pressure on learners across the country.
Despite the increased allocation, HELB continues to grapple with financial challenges. In recent years, the board has reported funding shortfalls after requiring more than KSh112 billion to meet student demand but receiving less than half of that amount.
The situation has left hundreds of thousands of students struggling to access financial support for their education.
The board has also faced pressure from rising loan defaults, with non-performing loans surpassing KSh30 billion. HELB attributes the challenge largely to high youth unemployment and unstable incomes among graduates, making it difficult for many former beneficiaries to repay their loans.
